Optimization of Parameters for Copper Electroplating in Through-Glass Vias

Zihao Guo; Junhao Li; Xiang Li; Haipeng Liu; Cunliang Yang; Zhiheng Yu; Yufeng Ma; Jingjing Wang; Jijun Feng

doi:10.6919/ICJE.202604_12(4).0049

Authors

Zihao Guo
Junhao Li
Xiang Li
Haipeng Liu
Cunliang Yang
Zhiheng Yu
Yufeng Ma
Jingjing Wang
Jijun Feng

DOI:

https://doi.org/10.6919/ICJE.202604_12(4).0049

Keywords:

Through-Glass Via (TGV); Copper Electroplating; Multi-step Electroplating.

Abstract

Through-Glass Via (TGV) technology has become a research hotspot in advanced electronic packaging due to its potential for high-density interconnections on glass substrates. However, the insulating nature and low adhesion of glass surfaces pose challenges to the uniform deposition of copper coatings. This study systematically optimizes the process parameters for copper electroplating in TGVs, with a focus on the effects of voltage, temperature, and sample movement speed on coating quality under single-step and multi-step plating conditions. In the experiments, vias were fabricated using picosecond laser drilling combined with wet etching, and direct current electrodeposition was performed after forming a seed layer via electroless copper plating. The results indicate that a lower voltage contributes to a smoother coating surface but requires a longer plating time; an appropriate temperature (30°C) enhances deposition efficiency; and excessively fast sample movement speed reduces filling integrity. Multi-step electroplating (e.g., 0.4 V followed by 1 V) significantly shortens the plating time while maintaining filling quality, thereby improving efficiency. The optimized process achieves void-free, high-adhesion copper-filled TGV structures, providing a feasible technical pathway for the application of glass substrates in high-frequency, high-density packaging.

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