Optimization Design of Integrated High-Temperature Valve Bonnet Heat Dissipation Structure and Orthogonal Sensitivity Analysis of Key Parameters
DOI:
https://doi.org/10.6919/ICJE.202511_11(11).0017Keywords:
Integrated High-Temperature Upper Bonnet; Finite Element Method; Orthogonal Optimization; Cooling Fin; Heat Dissipation; Packing Gland Temperature.Abstract
This study investigates a compact Integrated High-Temperature Upper Bonnet by quantifying how cooling-fin geometry affects the valve-stem packing gland and setting optimization priorities for high-temperature valves. A 3D steady-state thermal model was built in ANSYS Workbench using the Finite Element Method and evaluated under 525 °C process gas. Orthogonal Experimental Design with range analysis assessed fin number, fin diameter depth, and fin spacing. Simulations show that heat conduction across the 1.5 mm stem-to-bonnet gap must be modeled; otherwise the packing-gland peak temperature is overestimated by up to 15.7%. Benchmarking indicates the integrated bonnet (235 mm) matches the cooling of a traditional extended bonnet (380 mm) while reducing height by 38.2%. Parameter influence ranks as fin number (R_A = 36.89) > fin diameter depth (R_B = 21.12) > fin spacing (R_C = 9.50), identifying fin number as the primary design lever. These results validate the integrated bonnet’s thermal performance and compactness and provide quantitative evidence for design and safety certification of high-temperature industrial valve accessories.
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