Hole Injection and EBL Structure Optimization in GaN Micro-LEDs based on Silvaco TCAD
DOI:
https://doi.org/10.6919/ICJE.202609_12(9).0009Keywords:
Micro-LED; Silvaco TCAD; Electron Blocking Layer; Hole Injection; Two-Dimensional Device Simulation.Abstract
As Micro-LED display technology advances toward higher resolution, higher brightness, and higher current density, the effects of device scaling on carrier transport and interfacial behavior become increasingly significant. In GaN-based Micro-LEDs, the distinct effective masses, mobilities, and transport characteristics of electrons and holes generally result in weaker hole injection, which can lead to nonuniform carrier distribution in the active region and thereby limit radiative recombination in the quantum wells. Although the electron blocking layer (EBL) can suppress electron overflow toward the p-GaN side, its thickness and acceptor doping conditions also affect hole transport into the multiple-quantum-well (MQW) region. Therefore, the EBL structure and p-GaN doping require further optimization. In this work, a two-dimensional GaN/InGaN MQW Micro-LED device model was established using Silvaco TCAD. A self-consistent drift-diffusion transport model was employed to analyze the internal band structure, hole quasi-Fermi level, and hole current density. The results provide a two-dimensional TCAD-based approach for the optimization of EBL and p-GaN structural parameters in GaN-based Micro-LEDs.
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