GUO, Zihao; LI, Junhao; LI, Xiang; LIU, Haipeng; YANG, Cunliang; YU, Zhiheng; MA, Yufeng; WANG, Jingjing; FENG, Jijun. Optimization of Parameters for Copper Electroplating in Through-Glass Vias. International Core Journal of Engineering, [S. l.], v. 12, n. 4, p. 468–476, 2026. DOI: 10.6919/ICJE.202604_12(4).0049. Disponível em: https://icj-e.org/index.php/ojs/article/view/339. Acesso em: 21 apr. 2026.